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TrendForce Reports 1Q17 Global Smartphone Production Volume Fell 23%

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Published: Apr 11,2017

 

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ADAS Market to Surpass 302 Million Units Annually in 2022, IHS Markit Says

Global automotive applications of advanced driver assist systems (ADAS) will surpass 302 million units annually in 2022, according to new analysis from IHS Markit. In its latest ADAS Applications and Sensors Report, IHS Markit forecasts that global ADAS growth will be led in part by new introductions of automated autopilot...

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LED Taiwan Opens Tomorrow in Taipei

TAIPEI, Taiwan — Organized by SEMI and the Taiwan External Trade Development Council (TAITRA), LED Taiwan 2017 will open tomorrow in Taipei, will attract over 12,000 visitors from over 60 countries and leading manufacturers...

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III and China Steel Jointly Collaborate on Industrial Smart Glasses Solution

TAIPEI, Taiwan - Institute for Information Industry (III) Smart Network System Institute and China Steel Corporation are jointly collaborating on the “Remote Master” smart glasses industrial solution. Using a specialized helmet equipped with smart glasses, it provides real-time working environment images, language voice communication, and remote guidance functionality to reduce difficulties for employees when operating machinery...

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Afubot, an Open, Solid and Practical Assistant Robot From IEI Integration

TAIPEI, Taiwan - This one is different. Leading Taiwanese industrial computer manufacturer, IEI Integration's, Afubot has solid manufacturing processes and pragmatic industrial thinking, and you definitely will not just use it as a high-end toy...

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Foreign Fabs in China to Compel Country’s Domestic Foundries to Expedite Their 28nm Production

According to the global market intelligence firm TrendForce, Semiconductor Manufacturing International Corporation (SMIC) and Shanghai Huali Microelectronics Corporation (HMLC) are the two leaders among Chinese foundries in the development of the 28nm processing...

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SK Hynix Introduces Industry's Highest 72-Layer 3D NAND Flash

SK Hynix Inc. today introduced the industry's first 72-Layer 256Gb (Gigabit) 3D (Three-Dimensional) NAND Flash based on its TLC (Triple-Level Cell) arrays and own technologies. The company stacks 1.5 times more cells for the 72-Layer 3D NAND than it does for the 48-Layer 3D which is already in mass production...

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