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Qualcomm Founder Irwin Mark Jacobs to Donate NT$60M to Assist Taiwan’s Academic Innovation
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Published: Feb 25,2016
Visualizing Warpage Behavior during Post-mold Cure Stage in IC Packaging Using Advanced CAE Technolo
Epoxy Molding Compounds (EMC) are thermosetting plastic materials that are commonly used in the IC encapsulation process. During the filling stage of the encapsulation process, the cross-linking of polymer chains occurs as the temperature increases; when the cross-linking reaction reaches a certain degree, the EMC encapsulates will start to cure, which ultimately leads to better mechanical properties and stability of the finished products...
Acer Monitors Rank No. 1 in North American Retail Market of more Than 20% in 2015
TAIPEI, Taiwan － Acer was the No. 1 ranking brand for LCD monitors in the US retail market for year 2015, according to global information company, The NPD Group. Acer led the market with more than 20 percent market share and grew 26 percent year-on-year for unit shipments, far exceeding the industry average of 6 percent...
ZTE and Korea Telecom Showcase Pre5G at MWC 2016
ZTE today announced its joint demonstration with Korea Telecom at Mobile World Congress 2016. The companies will exhibit a Pre5G Massive multiple input multiple output (MIMO) base station demonstrating their latest cooperative achievements in the 5G field...
Tsinghua Unigroup to Adjust Its Approach to Get NAND Flash Technology After Terminating the WD Deal
Unisplendour, the Hong Kong-based subsidiary of Chinese technology conglomerate Tsinghua Unigroup, announced on February 23 that its board decided to terminate their investment plan in U.S. data storage company Western Digital (WD)...
AUO Lifts New Display Products for 2016; AMOLED Lights Up
TAIPEI, Taiwan － AUO(AU Optronics Corp) yesterday held new products and technologies announcement conference at its headquarters in Hsinchu, Taiwan, where the company showcased a new 65-inch borderless flat ALCD TV panel, Free-form Cutting curved 25-inch automotive touch panel, 12...
Advantech Partners with Industrial Leaders on Promoting Open IoT Sensing Platform
TAIPEI, Taiwan － Advantech on February 24 at Embedded World held the M2.COM open standard IoT sensing platform launching ceremony. ARM, Bosch Sensortec, Sensirion, and Texas Instruments were also in attendance at the event to collectively promote the M2...
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