News
GUC Works Jointly with A Major Japanese IDM Partner to Develop USB3.1 PHY/Controller IP
By
Published: Feb 26,2016
HP Collaborates with iPass to Give Wi-Fi Access to Customers Around the World
HP announced it is extending its collaboration with iPass Inc. to bring iPass’ global Wi-Fi network to HP customers on select HP notebook and tablet PCs worldwide. Customers who purchase new select HP notebooks, hybrid PCs, phablets and tablets with the iPass option will be able to access millions of hotspots on the iPass global Wi-Fi network for one, two, or three years at no additional cost starting in 2016...
Visitors to the MWC 2016 Surpass the 100,000 Mark for the First Time
Visitors to the MWC 2016 surpassed the 100,000 mark for the first time in the event’s history, with nearly 101,000 attendees, an increase of more than six per cent over last year, the GSMA reported today. Additionally, nearly 4,000 people participated in the ESL Expo Barcelona, which took place the weekend prior to Mobile World Congress...
Samsung Announces Mass Production of 256GB Embedded Memory Based on V-NAND Flash
Samsung Electronics announced today that it is now mass producing the industry’s first 256-gigabyte (GB) embedded memory based on the Universal Flash Storage (UFS) 2.0 standard, for next-generation high-end mobile devices. T The new Samsung UFS memory satisfies needs for ultra-fast speed, large data capacity and compact chip size in high-end smartphones...
Sharp Agrees to Be Acquired But Foxconn Says Not Yet
TAIPEI, Taiwan － Sharp announced today that the comoany agreed to accept Hon Hai/ Foxconn’s reconstruction program of JP¥700 billion, and to be auguired by Foxconn. However, Foxconn said that the two sides have not reached a consensus...
Qualcomm Founder Irwin Mark Jacobs to Donate NT$60M to Assist Taiwan’s Academic Innovation
TAIPEI, Taiwan － According to Taiwan's Economic Daily News, Qualcomm founder Irwin Mark Jacobs will donate NT$60 million to Taiwan National Tsing Hua University for developing the academic innovation. This is the first time for Irwin Jacobs to contribute Taiwan’s universities in capital donation...
Visualizing Warpage Behavior during Post-mold Cure Stage in IC Packaging Using Advanced CAE Technolo
Epoxy Molding Compounds (EMC) are thermosetting plastic materials that are commonly used in the IC encapsulation process. During the filling stage of the encapsulation process, the cross-linking of polymer chains occurs as the temperature increases; when the cross-linking reaction reaches a certain degree, the EMC encapsulates will start to cure, which ultimately leads to better mechanical properties and stability of the finished products...
Top Stories
Most Popular
Address: Rm. A204, No. 287-2, Sec. 3, Chengde Rd., Datong Dist., Taipei City , Taiwan (R.O.C.)
Phone:+886 2 2585-5526
E-Mail:en@ctimes.com.tw