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MediaTek Keens to Stay Ahead of 5G Technology

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Published: Feb 23,2016

 

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ThroughTek Expands on IoT Solutions for Surveillance and Smart Home at MWC

TAIPEI, Taiwan - ThroughTek, a Taiwanese IoT platform solutions provider, worked with the Kalay Platform to showcase its IoT solutions for surveillance, smart Home and unveils future data initiatives at MWC 2016 in Barcelona...

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HTC Reveals Complete Vive System at MWC, Available for Pre-order

HTC handed with Valve, today unveiled the consumer edition of its Vive virtual reality system. This complete Vive system, powered by SteamVR, introduces yet another new technology, can be pre-ordered at priced of US$799 from 29th February 2016...

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Taiwanese Companies Acer, ASUS, D-Link and ZyXEL Showcase Their Latest Products at MWC

The Taiwan Excellence Pavilion, an exclusive showcase of mobile communication technology of Taiwan, has been unveiled on the opening day of MWC 2016. Including Acer, ASUS, D-Link and ZyXEL are demostraing their latest products at this showcase...

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Siemens, IBM Team on Next-gen of Cloud-based Building Energy Management Solutions

The Siemens Buildings Technologies Division and IBM announced today cloud-based solutions that will leverage Siemens’ building expertise and IBM Internet of Things (IoT) capabilities to maximize the potential of connected buildings and the data they create, helping corporate real estate owners across multiple industries drive business results and meet energy efficiency goals...

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China, India Forecast to Account for 45% of the Subscriber Increase in Mobile Network

Almost three-quarters of the world’s population will be connected to a mobile network by 2020, according to the latest study from GSMA Intelligence, the research arm of the GSMA. And China and India are forecast to account for 45 percent of the subscriber increase over the next five years...

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AAEON Exhibits Its Latest in Embedded World 2016

AAEON will showcase a wide array of products for the burgeoning IoT paradigm at Embedded World 2016 in Nuremberg from February 23 – 25, 2016. From modules to boards of varying form factors, embedded to rugged handheld devices...

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