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Industry's Lowest Power PCI Express 3.1 IP Solution for Mobile SoCs
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Published: May 22,2015
Lose power, not data. New ultra-low-power FRAM MCU
Overcoming a design hurdle that has burdened engineers for decades, Texas Instruments (TI) announced a revolutionary Compute Through Power Loss (CTPL) technology to enable context save and restore across its MSP430 FRAM microcontroller (MCU) family, including the new MSP430FR6972 MCU...
Super Red, Red, Amber, and Yellow Ultra-Bright LEDs in Compact SMD Packages
The Optoelectronics group of Vishay Intertechnology has introduced a new series of super red, red, amber, and yellow ultra-bright LEDs in compact untinted surface-mount packages with dome lenses. Utilizing the latest ultra-bright AllnGaP on Si chip technology, the Vishay Semiconductors VLD...
ASRock Rack Presents The High Specification EP2C612D24
ASrock Rack introduces the latest high performance server board EP2C612D24, it is a very high-end solution for intensive compute tasks, big data analysis, Hadoop and cloud computing. As how it calls, EP2C612D24 features Intel Xeon E5 v3 processors with dual sockets...
Smallest IGBT gate-driver for 90 kW-500 kW inverters
Power Integrations launched its 2SC0115T2A0-12 dual-channel gate-driver core for 90 kW to 500 kW inverters and converters. Leveraging SCALE-2+ integrated circuit and isolated transformer technology for DC/DC power and switching signal transmission, the new driver core improves system reliability and performance by eliminating the need for an opto-coupler...
Wide-voltage Range, Fanless 3.5” Atom-based SBC
Axiomtek has launched CAPA840, its fanless 3.5-inch embedded single board computer based on the latest generation of Intel Atom processor E3845 or E3827 featuring 1.91/1.75GHz clock speed. Two DDR3L SO-DIMM slots support system memory up to 8 GB...
0.6mm Thinline Supercapacitors for Wearable, Ultra-Portable and Connected IoT Devices
CAP-XX today launched its Thinline series of single-cell supercapacitors. The world's thinnest at 0.6mm thick, and with prices starting at less than US$1 in large volumes, Thinline was developed to address the size, weight and cost challenges of designing thin, sometimes disposable electronic devices for the Internet of Things (IoT)...
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