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New FPGA Kit Enables OEMs to Expedite Prototyping and Application Development
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Published: Jul 15,2014
Brad PC Network Interface Cards Ease Transition and Visualized High-Speed Systems
Molex Incorporated released its next generation Brad applicomIO fieldbus NIC, an all-in-one PC-based control solution for customers with limited knowledge of fieldbus technology. The applicomIO package provides the NIC, configuration software, development libraries and OPC data server in one complete package for successful, cost-effective implementation of control applications...
New Intel Atom Processor E3800 and Celeron J1900 Product Family Embedded Systems
Avalue Technology Inc., is unveiling a new Intel Atom processor E3800 and Celeron J1900 product family embedded systems, including EMS-BYT, EPC-BYT, ASM-BYT, EPS-BYT-2PCI and ERS-BYTE-10COM. The Intel Atom processor E3800 is a system-on-chip (SoC) formerly codenamed “Bay Trail...
The MI987 Mini-ITX Motherboard Based on 4th Generation Intel Core Processor
IBASE Technology Inc. releases the MI987 Mini-ITX motherboard that is based on the Q87 chipset designed to support socket LGA1150 4th Generation Intel Core i7/i5/i3 desktop processors built on the latest 22nm process technology...
New RF Upconverter Yields The Most Compact Vector Signal Generator with Up to 20 GHz
With the addition of the new R&S SGU100A RF upconverter, Rohde & Schwarz expands its tried and tested R&S SGS100A vector signal generator to cover microwave applications. The combination of the two instruments yields the most compact vector signal source on the market with up to 20 GHz...
Industry's Most Accurate Test Solution for USB 3.1 Receivers
Agilent Technologies Inc. announced the industry's most accurate test solution for characterizing USB 3.1 receivers. Using the Agilent USB 3.1 receiver test set, design and test engineers in the semiconductor and computer industry can now accurately characterize and verify USB 3...
iST Develops Exclusive G2 WLCSP Circuit Edit Solution
Lab service provider Integrated Service Technology (iST) announced today new breakthrough in IC FIB circuit edit. With exclusive preprocessing engineering methods, iST has developed the second generation circuit edit solution for wafer-level chip scale package (WLCSP) to effectively shorten work time and enhance circuit edit success...
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