“Recently Intel has published some data in investor meeting that our 16 FinFET project has been behind and we think that the data is highly misleading,” TSMC chairman Morris Chang serously said.

So then the newly appointed TSMC president and co-CEO Andy Liu follow up to explain that 16nm FinFET has been a very fast paced development work in TSMC, will be passed through the technology qualification and ready for customer take-out soon.

In other words, short time to market has remained the competitive advantage of TSMC that open technology is where its rivals are fallen behind.

“16nm FinFET plus has been a head of our plan, ” Andy Liu said.

Referring to the 16nm FinFET plus is a advanced version of 16nm FinFET that has 15% better performace improvement than its predecessor, as well as TSMC is working on the the 10nm FinFET that will be thrid generation technology.

However, Andy Liu concluded that the competition between Intel and Samsung should be in the real customer's product. In terms of basement, applicaton precessor, graphics, CPUs, servers, etc. that proven TSMC 16nm FinFET are widely used.

Moreover, Andy Liu said that TSMC is confident that those which used 16nm FinFET in mobile products will be better than using Intel's 14 SoC or Samsung's 14nm regarding to performance and speed.

According to an earlier report that Intel is preparing a 14nm process, and using it to build its new Broadwell processor. The company, however, said in October that production of its Broadwell chips will be pushed back until the first quarter of this year due to a manufacturing defect in the technology. Samsung is also working on 14nm chip making technology.

“Recently Intel has published some data which showed our 16nm FinFET(Fin Field-Effect Transistor), we think that the data is highly misleading”, Andy Liu said.