This collaborative business model, combining Inotera’s front‐end wafer processing capability with ASE’s IC packaging and testing technology, will serve to deliver solutions featuring high quality, stable yield and an efficient cost structure, to a broader customer base and market.

SiP technology is integral to many end market applications including products incorporating biometric touch, sensors, wireless, power management, camera modules, RF front end and lighting, all of which are prevalent within today’s vast technology landscape.

Essentially, SiP is a module containing an electronic system or sub‐ systems that utilize such 2.5/3D IC packaging technologies to miniaturize the package. Together with ASE’s electronic manufacturing services (EMS) subsidiary, Universal Scientific Industrial (USI), ASE is offering customers a complete SiP solution, encompassing design to manufacturing to logistical integration.

“Inotera hopes to contribute our high‐quality and cost‐effective manufacturing capability to ASE’s SiP solution through the collaboration,” said Dr. Scott Meikle, President of Inotera.

“By combining strengths complementary and maintaining a full commitment to our DRAM capacity, Inotera and ASE can provide an enabling capability to the semiconductor supply chain,” emphasized Dr. Meikle.

“ASE recognizes that collaboration within the supply chain is critical to the success of our vision for system integration, and it is through the establishment of strong partnerships that we can work together to bring optimum value and just‐in‐time solutions to our customers,” said Dr Tien Wu, Chief Operating Officer, ASE Group.

He continued, Inotera is a proven leader in DRAM wafer fab technology and has expanded their capabilities to offer silicon interposer foundry services to benefit ASE’s complete SiP solution.