Taipei, Sunday, May 05, 2024, 19:35

News

LTE Protocol Stack from NextG-Com Now Available on Cadence Tensilica Processor

Published: Jun 25,2014

Cadence Design Systems, Inc. , today announced that NextG-Com has completed its port of the ALPS520 LTE Layer 2 and 3 protocol to the Cadence Tensilica ConnX BSP3 processor core. This combined hardware/software solution can be used to speed the design of LTE modems for cellular phones, tablets and other end-user equipment.

More on This

Cadence and UMC Certify mmWave Reference Flow on 28HPC+ Process for Advanced RF Designs

HSINCHU, Taiwan - Cadence Design Systems and United Microelectronics Corporation announced that the Cadence millimeter w...

Cadence Teams with TSMC, Microsoft to Reduce ICs Design Timing Signoff Schedules with the Cloud

Cadence Design Systems today announced the results of a three-way collaboration with TSMC and Microsoft focused on utili...

The NextG-Com ALPS520 LTE protocol stack implements Layers 2 and 3 for FDD and TDD User Equipment (UE) terminals compliant to 3GPP Release 11. The ALPS520 is fully tested against 3GPP 36.523 conformance tests. The protocol stack components also come with a host of tools (Trace, ASN.1, SE-RTOSTM), which aid in faster product development.

The ConnX BSP3 core is an optimized LTE Layer 1, 2 and 3 dataplane processor (DPU), ideal for system control and layers 2 and 3 protocol stacks. This core, coupled with the ConnX BBE DSP cores and the ConnX SSP16DPU, enables SoC developers to quickly implement software-programmable wireless communication modems.

“The NextG-Com team has developed a modular architecture protocol stack, leveraging the enhanced features of the BSP3, which is optimized for the low-level bit manipulation typical of L1 and L2 functionality,” stated Eric Dewannain, Cadence’s senior group director of baseband products. “Together with NextG-Com we can offer customers a total solution for fast implementation of LTE mobile devices.”

“The Tensilica ConnX BSP3 core offers a very small size and low-power implementation for LTE Layers 1, 2 and 3 for UE modem designs,” stated Denis Bidinost, CEO, NextG-Com. “Given Cadence’s great success in LTE designs, we are very excited about this partnership. Our roadmap for 3GPP Release 12 support and onwards is intended to enable both companies to continue to work together in the future.”

CTIMES loves to interact with the global technology related companies and individuals, you can deliver your products information or share industrial intelligence. Please email us to en@ctimes.com.tw

552 viewed

Most Popular

comments powered by Disqus