TSMC said that, amount to 60 pieces of tape out will supported o be done by the end of next year and the 16-nm process technology has reached its optimum performance in the final phase of development, compared to the past process technology.

The design eco-system is well constructed for 16-nm process and it will brings into new growing momentum for TSMC after mass production next year, stressed by TSMC. The system will support any EDA Tool received Silicon Certification and hundreds of design module and provide over 100 pieces of IP rights.

One of the TSMC’s supply chain reveals that China-based Hisilicon will be the first one to adopt TSMC 16-nm FinFET + in networking chip and cellphone CPU.