Under the leadership of Dr. Lu, Samuel, Dr. Wu, and Dr. Lin, Etron Technology's teams in Taiwan and the USA have finally been able to unlock the door to this long-held dream with a true breakthrough in physics and technology for ThingCapture. With the fast speeds, deep integration, and reduced costs of semiconductors and ICs, Etron has dramatically raised product quality levels to allow people to “ThingCapture” their treasured experiences and objects.

Dr. Lu said, “Our ThingCapture technology allows users to digitize objects in 3D and then, through 3D printing, to re-create those objects and embrace those associated memories. This is a new killer application to be added to the four major technology trends, Internet of Things, scan & print, wearables, and big data. Now you have an affordable way to capture physical items in 3D and to digitize, save, re-create and share them with your friends and family.”

The Etron's new “ThingCapture” technology can be experienced at ThingCapture@YouTube, ThingCapture@Facebook, www.etron.com.tw, including the “OK360TM” (Object Kapture 360°) machines, users can personally view the launch of a new ThingCapture era. Etron hopes to inspire users to accelerate efforts in this area together with Etron and share this exciting technology further with the public.

The ”ThingCapture” ICs and platform will be showcased at the International CES in Las Vegas on January 6 to 9, 2015. “OK360TM” machines will also be tested in situ at the CES. eSP870 ICs has been produced in volume. The end products will be launched in the third quarter of 2015, making for the most exciting Christmas gifts next year.

Moreover, echoing the USB 3.1 era, which means the Type-C works better. The company also unveiled a series of new USB products, including USB PD 2.0 chip, USB Type-C Switch programmable logic controller, and USB Type-C Switch plus PD 2.0 multi-function chip at CES 2015.