The top five suppliers saw the biggest gain in 300mm capacity share. At the end of 2014, the top 5 300mm wafer capacity holders represented 73% of worldwide capacity, 15 points more than the 58% they held in 2010.

As of December 2014, Samsung had the most 300mm wafer capacity at nearly 1.0 million wafers per month, which represented 23.5% of the world’s total 300mm wafer capacity. Samsung uses most of its 300mm capacity to fabricate DRAM and flash memory devices although a significant share is dedicated to manufacturing cellphone and tablet computer processors for itself and others.

Three other memory suppliers were next in line in the ranking. Micron quickly moved into the number two position after acquiring Elpida and its 300mm wafer fab facilities. Micron’s 300mm wafer capacity includes its share of capacity from joint ventures with Intel (IMFT) and Nanya (Inotera). Toshiba/SanDisk and SK Hynix were ranked #3 and #4 respectively in the list with both having opened and/or expanded 300mm wafer fabs within the past few years. Collectively, these four memory suppliers accounted for 62% of global 300mm wafer fab capacity at the end of 2014.

Three foundries—TSMC, UMC, and GlobalFoundries—appeared in the ranking. TSMC, the largest pure-play foundry in the world, had installed 300mm capacity of 430,000 wafers per month at the end of 2014, which represented 10.3% of total worldwide 300mm capacity.

For TSMC, 300mm capacity accounts for 44% of its total wafer fab capacity, with 200mm wafers accounting for 47% and 150mm wafers, 9%. GlobalFoundries’ capacity is split 51% for 300mm wafers and 49% for 200mm wafers. For UMC, 300mm wafers represent 26% of its total capacity with 200mm wafers accounting for 65%, and 150mm wafers accounting for 9%. Foundry suppliers shown on this list held 18% of worldwide 300mm wafer fab capacity at the end of 2014.