Taiwan Semiconductor Manufacturing Company (TSMC) is the biggest shareholder of Xintec, which shares 48 percent of the company. Judging from the company's revenue, visual sensors topped all the other product lines and occupied 60 percent.

Xintec was founded in 1998, and was the first commercialized three dimensional wafer level chip scale packaging (3D WLCSP) company. Started from CMOS image sensor, Xintec offers the best production cycle time and competitive cost. With the highest product integration capability, 3D WLCSP technology can be applied into various market segments, such as consumer, communication, PC, industrial and automotive.

The product applications of the company include Image Sensors, Optical Sensors, Power Management IC, Power Discrete, Analog IC, Mixed Signal IC, MEMS and Integrated Passive Device (IPD) etc.

Xintec engages in innovative 3D WLCSP packaging manufacture services, guided by our core value of Integrity, Innovation and Customer orientation. Xintec is a subcontractors of advanced packaging services and to be the largest 3D WLCSP service provider.

Guan Xin revealed that the company is going to set up 12-inch wafer-level packaging line before the third quarter of this year.