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TSMC to Enter 7nm and 10nm Era In 2016

By Korbin Lan
Published: Apr 16,2015

TAIPEI, Taiwan - Taiwan Semiconductor Manufacturing Company(TSMC) said at the investor conference today that its next generation advanced process technologies, including 10nm and 7nm, is progressing well, and expected to delivery to customers in 2016.

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TSMC Co-CEO Mark Liu said, the 10nm process is progressing smoothly and is expected to complete the qualified test production in the fourth quarter of this year, and has recently successfully finished a fully functional yield of 256MB SRAM. At present, more than 10 clients fully engaged with TSMC on the 10nm process technology, TSMC still expected to go mass production in the Q4 2016, and contribute revenue at the early of 2017.

Mark Liu pointed out that 10 nm process using third-generation of FinFET transistors, more scaling than the first generation. With a very competitive price and performance, 10nm technology can be used in a variety of applications, including applications processor, baseband soC, internet processor and CPUs.

In terms of 7nm process, Mark Liu said, TSMC started it from the beginning of last year, it is also progressing well, and in cooperation with a number of major customers. TSMC scheduled to start mass production in the early of 2017.

Mark Liu stressed that with entering the 7nm and 10nm production process, TSMC will give customers a high cost performance ratio technology to develop new generation of products and create more new applications.

Currently, TSMC said it still retains the leading position in the advanced process, and also has the largest production capacity of 28nm.

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