According to current news sources, it is possible that Nintendo’s brand new gaming host “NX” will go into test production in October of this year. Moreover, Nintendo is planning for its specifications to be finalized between February and March of next year and for it to enter the mass production stage between May and June. Nintendo’s goal is to reach 20 million shipments during the first year.

Meanwhile, Taiwanese supply chain providers for Nintendo, including flash memory manufacturer, Macronix, machine casing manufacturer, Foxconn, image sensor manufacturer, Pixart Imaging, and chip packaging industry’s ASE are all likely to continue to be part of the NX supply chain and provide semiconductor components.

Furthermore, AMD CEO Dr. Lisa Su announced a few days ago at an investor’s conference that they had already obtained a third semi-customized chip design order. Because both PS4 and Xbox One both currently use AMD chips, the third case that Dr. Su mentioned is most likely a project for the new Nintendo product.