Materials are essential in semiconductor industry, the ultra soft copper bonding wire exhibits significantly better conductivity than gold or aluminum. Intermetallic growth by copper wire bonds is significantly slower than in gold wire bonds, according to Niche-Tech.

Therefore, with lower electrical resistance, lower heat generation and higher mechanical properties, this result in higher reliability and better device performance.

In addition, ultra soft copper wire can reduce pad metal splash and it displays excellent ball neck strength and high loop stability during molding or encapsulation. In other words, it sis a gold choice to replace gold wires with ultra-soft copper bonding wires.

Moreover, the ultra soft copper bonding wire has been adopted by Everlight Electronics Co. from Taiwan, which has passed the preliminary test.

Niche-Tech is dedicated in the development, manufacture and marketing of high quality products for the semiconductor packaging, LED packaging and chip on board industries. Bonding wire, silicone encapsulant, epoxy encapsulant and adhesive are its main products.