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Apple, Qualcomm, MediaTek and Hass to Embrace TSMC’s InFO Packaging Technology
By Korbin Lan
Published: Nov 16,2015
TAIPEI, Taiwan －According to a report from Taiwan Economic Daily, Apple, Qualcomm, MediaTek and Hass will adopt TSMC’s InFO packaging technology before the end of first quarter of 2016.
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The report said that TSMC has invest massively on advanced packaging equipments, the cost of capital reached 125.358 billion that allowed by the board of directors last week, to accelerate advanced production progress, expand and buildup the packaging capacities.
TSMC’s new advanced packaging technology, called InFO, allows cost-effective system scaling to increase system bandwidth, while decreasing power consumption and device form factors.
In contrast to other technology, InFO will be the ideal solution for mobile and Internet of Things (IoT) applications.
TSMC InFO technology will be implemented in Apple products, besides, Qualcomm, MediaTek and Hass are going to use Info and predict to enter into mass production for the second quarter of 2016, the report said.
(TR/ Yiting Wang)
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