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ASRock Rack Joins Open Compute Project U.S. Summit 2016

Published: Mar 07,2016

ASRock Rack, a Taiwanese high-performance and high-efficiency server technology provider, is showcasing its OCP3-1L and OCP3-6S in Open Compute Project (OCP) U.S. Summit.

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ASRock Rack has collaborated with Lite-On Power System Solution to exhibit a 19” open rack system including 9 torpedoes from OCP3 series with customized supporting shelves. OCP3 series is ASRock Rack’s OCP solution.

It supports dual Intel Xeon E5 2600 v3 and memory slots up to 1024GB, capable of handling massive computing tasks. For large-scale datacenters, the effective power consumption is key. ASRock Rack’s OCP products achieve up to 9% lower consumption than existing providers, which results in an eco-friendly and cost-effective solution

ASRock Rack also provides PIN headers for VGA/IPMO for customers’ various applications. It fits their requirements for design for services (DFS) and design for manufacturing (DMS).

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