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ASRock Rack Joins Open Compute Project U.S. Summit 2016
Published: Mar 07,2016ASRock Rack, a Taiwanese high-performance and high-efficiency server technology provider, is showcasing its OCP3-1L and OCP3-6S in Open Compute Project (OCP) U.S. Summit.
ASRock Rack to Showcase High-density 1U Solution and SoC Platform at WHD 2016
ASRock Rack announced that th company will showcase its latest products at WorldHostingDays.global 2016 (WHD) in Rust, Germany...
New Server Motherboards on Greenlow Platform
ASRock Rack released the new series of server motherboard based on Intel Greenlow Platform. The new models are in uATX, ATX and miniITX...
ASRock Rack has collaborated with Lite-On Power System Solution to exhibit a 19” open rack system including 9 torpedoes from OCP3 series with customized supporting shelves. OCP3 series is ASRock Rack’s OCP solution.
It supports dual Intel Xeon E5 2600 v3 and memory slots up to 1024GB, capable of handling massive computing tasks. For large-scale datacenters, the effective power consumption is key. ASRock Rack’s OCP products achieve up to 9% lower consumption than existing providers, which results in an eco-friendly and cost-effective solution
ASRock Rack also provides PIN headers for VGA/IPMO for customers’ various applications. It fits their requirements for design for services (DFS) and design for manufacturing (DMS).
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