Hsiao-Ping Lin, Chairman and CEO of M31, says “M31 has developed various IP solutions on TSMC 28HPC+ process. Among these IP products, TSMC’s 28HPC+ ULL (Ultra Low Leakage) SRAM Compilers feature one of the lowest power characteristics in the market. The new M31 IP technology with its "Green Low Power" design approach, available in the first quarter of 2016, is a complete set of solutions for advanced low-power SoC designs.”

"28HPC+ enhances the very successful 28HPC process,” said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division.

“With the 28HPC+ process, customer SoCs can operate at a higher speed with the same power consumption, or with lower leakage at the same operating speed. The combination of the TSMC 28HPC+ leading process and M31 IP enable customers to realize the benefits of performance and power in developing their cutting-edge products."

M31 28HPC+ IP solutions include a complete set of Green Low Power memory compilers, which are “One Port Register File,” “Two Port Register File,” “High Density Single Port SRAM Compiler,” “High Density Dual Port SRAM Compiler,” and “High Density VIA ROM Compiler.”

All M31 28HPC+ memory compilers are fully featured, supporting multiple power saving modes. Based on the design requirements, a designer is able to choose the most optimized power-saving mode to compile a memory, for the purpose of long battery life of the mobile device.

In addition, there are two design kits available, Low Power Optimization Kit and Power Management Kit to further maximize designs for high speed and low power. These power-saving methodologies are applicable to all of the following cell libraries: High Density 7-Track Library, General Purpose 9-Track Library, and Ultra-High Speed 12-Track Library.

Furthermore, M31 also develops differentiated high speed interface IP solutions on 28HPC+ process for other applications. These IP are USB PHY for USB applications, PCIe PHY for Solid-State Drive (SSD) market, MIPI D-PHY for mobile devices, and MIPI M-PHY for Universal Flash Storage (UFS) applications. Such IP can solve the needs of interoperability in various types of mainstream intelligence devices.

With M31’s various IP on TSMC’s 28HPC+ process, these solutions enable chip designers to implement lower power, higher performance, and smaller die area for intelligent devices in the applications of mobile audio/video, smart autonomous vehicles/airplanes, automotive electronics, and global positioning systems, among others.