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Shipment of MCU Chips of Hua Hong Semiconductor Hits Historical Record

Published: Aug 23,2016

Hua Hong Semiconductor Limited, together with its subsidiaries, the "Group", a pure-play 200mm foundry, announced that its shipment of microcontroller (MCU) chips in the first half of 2016 grew to 1.2 billion, a year-on-year increase of 50%, breaking the historical record.

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Hua Hong Semiconductor has the eFlash/eEEPROM (embedded Electrically Erasable Programmable Read-Only Memory) process platform for high-end 32bit MCUs and the cost-effective 0.18um 3.3V/5V CE OTP/MTP (One-Time Programming/Multiple-Time Programming) process platform for entry-level 8bit MCUs.

To tap the potential in the burgeoning MCU market, Hua Hong Semiconductor delivers a comprehensive range of scalable and cost-effective solutions that perfectly fit a wide range of energy-efficient and intelligent applications including IoT, wearables, smart grid, embedded smart devices, healthcare electronics, smart lighting, industry and automotive electronics.

Based on its eFlash/eEEPROM process platform, Hua Hong Semiconductor delivers customized Flash IP/EEPROM IP that features high read speed up to 60MHz and low power with standby current less than 0.1uA. While delivering outstanding performance and reliability, the platform allows data retention up to 100 years and endurance up to 100,000 cycles, enabling customers to develop premium MCUs that cater the needs of diversified applications.

"Being committed to innovating and optimizing the embedded non-volatile memory process platform for smart card and MCU applications, Hua Hong Semiconductor has always been a leading foundry in this area," said Mr. Fan Heng, Executive Vice President of Hua Hong Semiconductor.

"In the future, emerging applications like IoT, cloud computing, big data, smart city and virtual reality (VR) will significantly boost the demands for MCUs. Echoing to this market demand and the new trends, the Company will continue to innovate on its MCU platform to provide customers with MCU solutions featuring lower power, higher performance, security, reliability and price-performance ratio."

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