Due to increasingly strict performance requirements from the LTE terminal market, RDA launched the RTM791x+RPM674x Phase-II series RF front-end chipsets in mid-2016, and has since commenced volume shipping via platforms such as Spreadtrum, MediaTek and ZTE Microelectronics Technology.

Achieving certification from Qualcomm and being able to start shipping to customers signals success in making RDA Phase-II series PA products across all key platforms. The product series delivers high performance at low cost and the superior experience that users have been waiting for.

As part of the RDA Phase-II series of products, the RPM6741-21 is compatible with LTE-FDD/TDD/WCDMA/TD-SCDMA/CDMA and meets the highest industry standards in terms of power consumption and spectral linearity requirements. The chipsets deliver excellent performance in extreme conditions, making it ideal for various complex application settings.

Following comprehensive testing, Qualcomm has given the RPM6741-21 a Gold Level recommendation. RPM6741-21 is recommended for use in core platforms including Snapdragon620/600/400 as well as the NB-IOT-compatible MDM9206, which will become commercially available in early 2017.

Dr. Leo Li , Chairman of RDA Microelectronics commented: "RDA Phase-II PA is a collection of high-performance and highly integrated RF front-end solutions supporting all the application settings including GSM, CDMA, 3G, among others. RPM6741-21 is the first Phase-II PA with certification from Qualcomm that was created by the in-house team of a China -based producer, serving to demonstrate that the country's advanced RDA PA technology is now in line with global standards. We will continue to invest and innovate in RF technologies and provide customers with competitive RF front-end solutions that help our customers succeed."