The company's SSD solution covers application-specific front end design capabilities, advanced node design flow experience, robust manufacturing management, and a production-proven IP set targeting TSMC 28HPC+ process technologies.

The IP set targeting ultra-low power and small footprint to enable customer with the best power and cost advantages, which includes (LP)DDR3/4 controller/PHY, ONFI 3/4 PHY, PCIe-3 PHY along with PLL, AFE, thermal sensor, VMK. Front-end IP from partner includes NVMe, LDPC, Security engine and ARM Cortex-R4, etc. Furthermore, GUC also provides FPGA system emulation kit, packaging and PCB SI/PI design service for customer quick time-to-market.

GUC's SSD ASIC capabilities were proven over the course of last year when the customer released multiple SSD products manufactured on TSMC's 28HPC+ process using GUC’s SSD platform.

"The ability of our innovative design services capability to overcome the challenge of integrating a customer's design with third-party and GUC IP is the key to achieving superior time-to-market and time-to-tape-out results, "explains C.J. Liang, GUC's Senior Vice President of R&D.

"The GUC SSD ASIC solution represents a one-of-a-kind service that is not available anywhere else. We successfully cooperated with third-partners on a FPGA platform build-up and SoC integration/ design/verification process. Our end-to-end approach delivers a seamless experience that results in better yield and faster time-to-market, "explained Ken Chen, President of GUC.