The new FPC1291 is a single-chip, single-die solution, removing the need for a companion chip while maintaining and even exceeding the performance benefits of the dual-chip solution. This third-generation sensor offers improved performance while simplifying the OEM design process as well as supporting easy hardware integration in applications like smartphones.

The FPC1291 sensor brings world-leading biometric performance and convenience. Design possibilities are unlimited as the sensor comes in different variations for all kinds of top layers, e.g. glass and ceramic coating.

"We are very proud to launch the third generation of fingerprint sensors, starting with FPC1291. It will not only have better biometric performance in everyday use cases, but also in tougher conditions as the new technology handles distortion like common mode noise better than ever before", says Pontus Jägemalm, Senior VP Research & Development and CTO at Fingerprints.

FPC1291 has undergone extensive testing and verification, and prototypes are available for smartphone manufacturers, in collaboration with leading module manufacturers. Full qualification of FPC1291 is planned during the first quarter of 2018.