Taipei, Thursday, May 22, 2018, 21:51


TSMC to Rush Production of 7nm; End Products to Come Out This Year

By Korbin Lan
Published: Apr 23,2018

TAIPEI, Taiwan - Although hopes are not high for the second quarter of this year, this is not affecting resolve to make full-fledged efforts to hurry along the production of new technologies. Taiwan Semiconductor Manufacturing Company, Limited (TSMC) at its Q1 investor conference stated that they will increase their yearly expenditures from US$11.5 billion to US$12 billion and use the funding to purchase the extreme ultraviolet light (EUV) equipment and masks needed for enhanced versions of 7-nm manufacturing processes. 7-nm manufacturing processes are currently moving into full-fledged mass-production, and after the second half of this year new products using these manufacturing processes are expected to come out.

More on This

Synopsys and TSMC Collaborate to Deliver Ultra-Low Power TSMC 22-nm Processes

Synopsys announced its collaboration with TSMC to develop DesignWare Foundation IP for TSMC's 22-nanometer (nm) ultra-low power (ULP) and ultra-low leakage (ULL) processes...

TSMC Continues to Dominate the IC Foundry Market

According to IC Insights’ McClean Report, the top eight major foundry leaders (i.e., sales of ≥$1.0 billion) held 88% of the $62...

TSMC co-CEO C.C. Wei stated that their 7-nm manufacturing is going smoothly, and they have comprehensively improved its yield, performance, and power consumption. Currently there are over 50 products which have been taped-out, and they estimate that some of these products will come out this year with applications in domains which include mobile phones, server CPUs, network processors, gaming GPUs, FPGAs, and automotive components. He also emphasized that TSMC’s 7-nm manufacturing is just entering into full production.

In addition, co-CEO C.C. Wei also gave an explanation of the development and implementation of the 7-nm enhanced version (7-nm +), which will be the next generation of 7-nm manufacturing technologies.

The other co-CEO, Mark Liu also emphasized that their EUV equipment is part of a completely new generation of technology and that TSMC have their sights locked onto 3-nm production as the objective for the development of the joint collaboration with ASML.

On the other hand, TSMC also pointed out that the importance of their wafer level packaging technologies, which include CoWoS (chip-on-wafer-on-substrate) and InFo, is continually increasing, and they are becoming TSMC’s key chip manufacturing technologies.

At the same time, TSMC also reiterated that as 5G and AI applications go into effect, tremendous new demand will be brought about for the next generation of manufacturing technologies , such as mobile phone face-recognition technologies, AR and VR, data centers, ADAS and self-driving cars, and IoT applications.

(TR/ Phil Sweeney)

CTIMES loves to interact with the global technology related companies and individuals, you can deliver your products information or share industrial intelligence. Please email us to

497 viewed

comments powered by Disqus