News
TSMC to Rush Production of 7nm; End Products to Come Out This Year
By Korbin Lan
Published: Apr 23,2018
TAIPEI, Taiwan - Although hopes are not high for the second quarter of this year, this is not affecting resolve to make full-fledged efforts to hurry along the production of new technologies. Taiwan Semiconductor Manufacturing Company, Limited (TSMC) at its Q1 investor conference stated that they will increase their yearly expenditures from US$11.5 billion to US$12 billion and use the funding to purchase the extreme ultraviolet light (EUV) equipment and masks needed for enhanced versions of 7-nm manufacturing processes. 7-nm manufacturing processes are currently moving into full-fledged mass-production, and after the second half of this year new products using these manufacturing processes are expected to come out.
ITRI and TSMC Announces a New SOT-MRAM Technology at VLSI 2020
TAIPEI, Taiwan – Taiwan’s ITRI(Industrial Technology Research Institute) announced a world-leading SOT-MRAM technology which is co-developed with TSMC...
TSMC to Kick off Mass Production of Intel CPUs in 2H21, Says TrendForce
TAIPEI, Taiwan - Intel has outsourced the production of about 15-20% of its non-CPU chips, with most of the wafer starts for these products assigned to TSMC and UMC...
TSMC co-CEO C.C. Wei stated that their 7-nm manufacturing is going smoothly, and they have comprehensively improved its yield, performance, and power consumption. Currently there are over 50 products which have been taped-out, and they estimate that some of these products will come out this year with applications in domains which include mobile phones, server CPUs, network processors, gaming GPUs, FPGAs, and automotive components. He also emphasized that TSMC’s 7-nm manufacturing is just entering into full production.
In addition, co-CEO C.C. Wei also gave an explanation of the development and implementation of the 7-nm enhanced version (7-nm +), which will be the next generation of 7-nm manufacturing technologies.
The other co-CEO, Mark Liu also emphasized that their EUV equipment is part of a completely new generation of technology and that TSMC have their sights locked onto 3-nm production as the objective for the development of the joint collaboration with ASML.
On the other hand, TSMC also pointed out that the importance of their wafer level packaging technologies, which include CoWoS (chip-on-wafer-on-substrate) and InFo, is continually increasing, and they are becoming TSMC’s key chip manufacturing technologies.
At the same time, TSMC also reiterated that as 5G and AI applications go into effect, tremendous new demand will be brought about for the next generation of manufacturing technologies , such as mobile phone face-recognition technologies, AR and VR, data centers, ADAS and self-driving cars, and IoT applications.
(TR/ Phil Sweeney)
CTIMES loves to interact with the global technology related companies and individuals, you can deliver your products information or share industrial intelligence. Please email us to en@ctimes.com.tw
1890 viewed