Kulicke & Soffa will be showcasing the RAPID™ MEM, Gen-S Series of automatic wire bonder engineered to enable Industry 4.0 communication and is RoHS compliant. Its advanced process features such as real-time monitoring and diagnostics capabilities ensures quality and efficient assembly serving high-performance and high-reliability semiconductor applications.

In addition to the RAPID™ MEM wire bonder, the Company will also be demonstrating its Industry 4.0 connectivity software solutions – KNet PLUS and Auto OLP 2019 (auto offline programming). These solutions have been successfully deployed and implemented at customer sites globally to enhance quality, improve productivity and manage machine performance. Also, a 3D overview of the Liteq 500 projection stepper’s unique architecture and features will be available along with an augmented reality demonstration that highlights the ease and flexibility of the Asterion wedge bonder’s bond tool change-over capabilities.

Hoang Huy Hoang, Executive Vice President of K&S, stated, “K&S continues to partner with customers in many different application spaces to develop disruptive and market-leading solutions. We continue to push the boundaries, enter new markets and deliver high-value solutions to our customers and the industry.”

Customers could visit K&S’s booth #M0640/ 4F in Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1) to discuss more on their technological needs.