Over the next three years, 5G wireless traffic is expected to grow exponentially. Mobile carriers are adding millimeter wave infrastructure to meet the demand for more capacity. Sivers’s innovative AiP designs simplify millimeter wave designs by lowering power dissipation and reducing cost.

“The Sivers team is excited to bring a new approach to millimeter wave designs using our RFSOI technology delivering an end-to-end solution from transceivers to the air interface," said Frank Lane, Sivers Semiconductors VP of Engineering. "By working with LitePoint, we can rapidly characterize the beamforming on our phase array Antenna in Package (AiP) modules, and simplify test support for our OEM customers as they move into production.”

“Sivers’s approach to simplifying Antenna in Package designs mirrors LitePoint’s approach to simplify test and characterization,” said Rex Chen, Director of Strategic Business Development at LitePoint. “We are pleased to work with Sivers to support the development and deployment of their mmWave AiP technology to the 5G infrastructure both in product design and manufacturing test.”