The new SLC NAND family will be offered in densities from 1Gb to 8Gb in both 3.0V and 1.8V voltages, extended industrial temperature range with product longevity support.

Macronix has also unveiled NAND-based MCP (Multi-Chip Package) solutions to provide customers a complete portfolio of NAND Flash products. These NAND and MCP products are targeted at a broad range of applications for the embedded and wireless markets.

As customer applications and operating systems become more sophisticated, the need for more robust and higher-density storage solutions are growing. Macronix’s SLC NAND products were developed to support these market trends featuring the right balance of performance, high reliability, densities and voltages along with the longevity support from Macronix owned wafer fabs.

“The addition of the 36nm SLC NAND Flash products to our existing 512Mb and 1Gb first generation SLC NAND product family puts Macronix in a position to support virtually all of our customer demands for SLC NAND products.” said F.L. Ni, Vice President of Marketing at Macronix.

“Our expanded NAND portfolio along with our broad serial and parallel NOR and industry leading XtraROM® products exhibits Macronix’s continued commitment to the development and production of advanced non-volatile memory products and solutions to fulfill the growing demands from our customers.”

Features:

－ 36nm floating-gate process technology

－ Industrial temperature range (-40oC to +85oC)

－ High reliability with 100K program/erase (P/E) cycle endurance

－ SLC NAND performance with 25us random access, 25ns sequential access

－ Industry-standard 48-pin TSOP, and 63-ball VFBGA packages

－ Product Longevity Program support