Using Cree’s high-reliability ceramic package technology, the XLamp MH-B LED is able to operate at higher temperatures than MP LEDs with no reduction in rated lifetime, enabling an impressive 60 percent reduction in heat-sink size and cost.

Using up to 26 times fewer LEDs than MP LEDs to achieve the same level of performance, the XLamp MH-B is optimized to simplify LED system designs for applications where multiple MP LEDs are currently used.

“Cree has once again invented a lighting-optimized solution that can lower my costs and decrease manufacturing times,” said Frank Chen, technical director, Zhejiang Shenghui Lighting Co., Ltd. and Sengled Optoelectronics Co., Ltd.

“While chip-on-board LEDs are an attractive alternative to MP LEDs in terms of reliability and cost, they aren’t compatible with my automated manufacturing processes. The new XLamp MH-B LED finally gives me a more-reliable alternative to mid-power LEDs – I no longer have to compromise my brand and reputation to achieve a lower system cost.”

Featuring Cree’s EasyWhite technology and a small 5-mm light-emitting surface, the XLamp MH-B provides many system benefits over arrays of MP LEDs, including tighter beam angles, simpler optics, a more-traditional appearance and easier color consistency.

As a single LED, the XLamp MH-B LED delivers up to 830 lumens at 175 mA and can also be used in arrays to address higher-lumen applications that require low cost and high reliability, such as high bay, outdoor area and downlights.

“The new XLamp MH-B LED combines the reliability and manufacturability of Cree’s high power LEDs with the simplicity and performance of our CXA LED arrays,” said Paul Thieken, director of marketing, LED components.

“MH-B introduces a new technology platform that gives customers the best of both technologies, while avoiding the limitations of mid-power LEDs.”