The MX25R family supports the standard Serial NOR Flash memory interface with ultra-small product packages such as USON and WLCSP, and KGD (known good die) products for SIP (system-in-package) solutions.

“Low power consumption and small form-factor designs will be key factors in consumer acceptance of wearable devices,” stated Mr. Min-Cheng Lin, Macronix segment marketing department deputy director.

“We see next-generation memory advancing in three ways: 1. Standardized interfaces that will ease the process of importing data; 2. Smaller, lighter and slimmer form factors; 3. Power supply design focused on ultra-low voltage and energy consumption.”

Besides its wide-voltage/ultra-low power MX25R family, Macronix solutions popular in wearable products consist of 1.8V 512Kb–512Mb Serial NOR devices. These are offered in small footprints such as KGD (known good die) and WLCSP (wafer-level chip-scale packages).

Macronix MCP (multi-chip package) memory has also been utilized in many smart wearable products. The Company’s intensive research and development of innovative memory technologies has delivered VG (vertical gate) 3D NAND, using its own patented BE-SONOS technology to break through manufacturing process restrictions; and ReRAM (resistive random-access memory) technology utilizing a simple storage unit structure that features high speed and low power consumption for future wearable applications.

Features:

－ 1.7V ~ 3.6V Serial NOR (MX25R): 512Kb ~ 64Mb

－ Packages: 8-SOP、8-WSON、8-USON、WLCSP、KGD

－ 64Mb (sampling now)

－ 1.8V Serial NOR (MX25/66U): 512Kb ~ 512Mb

－ Packages: 2*3/ 4*3/ 4*4 USON、6*5/ 6*8 WSON、WLCSP、KGD

－ MX65U ( SPI-NOR + pSRAM) : 64Mb+32Mb, 128Mb +64Mb

－ MX69N ( AD-Mux PNOR + pSRAM): 64Mb +32Mb

－ MX69V ( AD-MUX PNOR + pSRAM): 128Mb +64Mb

－ Packages: 6.2*7.7 , 6*6 TFBGA

－ MX63U (SLC NAND + LPDDR2): 4Gb+2Gb, 2Gb+1Gb, 1Gb+1Gb

－ Packages: 8*10.5 VFBGA, 8*9 VFBGA