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Toshiba Expands New Packaging Option for SO6L IC-Output Photocouplers
Published: Mar 22,20181293 Read
Toshiba Electronic Devices & Storage Corporation is expanding its line-up of SO6L IC-output photocouplers with a new wide leadform package type SO6L(LF4). Shipments start today.
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The SO6L(LF4) package has a creepage distance of 8mm, which meets the industry’s standard creepage distance for SO6L.
To date, Toshiba has offered eight photocouplers in the SO6L(LF4) package: three for high-speed communication applications and five for IGBT/MOSFET drive applications. Now the company has added six photocouplers in the SO6L(LF4) package to its product portfolio: three for high-speed communication applications and three for IGBT/MOSFET drive applications.
The SO6L(LF4) package is footprint-compatible with the SDIP6(F type) package with wide lead-forming option and a maximum package height of 4.15mm. In addition, the SO6L(LF4) package has a maximum height of 2.3mm, which is approximately 45% thinner than the conventional SDIP6(F type) package. Its low profile package contributes to system size reduction and can be mounted in height-restricted locations, such as the back of a board.
Toshiba will release more IC-output photocouplers as direct replacements for the current SDIP6 (F type) package.
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