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Innodisk, Microsoft Announce Strategic Alliance for New Out-of-Band Standard for Secure AIoT
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Published: Nov 21,2019
Total Mobile Service Revenue in China Set to Reach US$165B in 2024
Increase in the demand for mobile Internet connectivity and growing unique subscriber base is set to drive the total mobile service revenue in China from US$153bn in 2019 to US$165bn by the end of 2024, says GlobalData, a leading data and analytics company...
Keysight, FormFactor and CompoundTek Join Forces to Accelerate Integrated Photonics Innovations
Keysight Technologies, FormFactor and CompoundTek have joined forces to accelerate integrated photonics innovations. Integrated photonics, also called silicon photonics, is a revolutionary technology that multiplies data transfer capacities while reducing power consumption and cost...
Global OSAT Market Shows Signs of Recovery in 2H19, But Yearly Revenue to Decline Slightly
According to the latest research from TrendForce, the decline in the global OSAT industry showed signs of a gradual halt in 3Q19, since the drop in memory prices began to slow down, and smartphone sales steadily recovered. The top ten OSAT providers posted a total revenue of US$6 billion in 3Q19, a 10...
Keysight Technologies Unveils Industry 4.0-ready In-Circuit Test (ICT) Suite
Keysight Technologies today announced the i3070 Series 6 In-Circuit Test (ICT) suite of solutions which enables electronics manufacturers to improve test throughput and the operational efficiency of their printed circuit board assembly (PCBA) manufacturing...
Fingerprint Cards Unveils New Slim Side-mounted Capacitive Sensor for Mobile Devices
Fingerprint Cards today announces the launch of a new side-mounted capacitive touch sensor for biometric authentication. Responding to customer demand, the slim FPC1540 sensor enables a range of the latest smartphone designs including borderless and foldable phones...
Cree and STMicroelectronics Expand and Extend Existing Silicon Carbide Wafer Supply Agreement
Cree and STMicroelectronics announced today the expansion and extension of an existing multi-year, long-term silicon carbide (SiC) wafer supply agreement to more than $500 million. The extended agreement is a doubling in value of the original agreement for the supply of Cree’s advanced 150mm silicon carbide bare and epitaxial wafers to STMicroelectronics over the next several years...
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