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Asia/Pacific Spending on Security Solutions Projected to Reach 16.4 Billion in 2019

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Published: Nov 19,2019

 

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Chen Liang-gee Meets NVIDIA Chief Scientist William J. Dally to Deepen AI Cooperation

TAIPEI, Taiwan - Taiwan’s Ministry of Science and Technology (MOST) has teamed up with NVIDIA once again following NVIDIA's response to MOST’s AI research strategy, and after jointly proposing five major directions for cooperation, MOST invited NVIDIA Senior Vice President and Chief Scientist William J...

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Faraday and UMC Collaborate to Launch a Complete Set of 22nm Fundamental IP

HSINCHU, Taiwan - Faraday Technology and United Microelectronics Corporation, today announced the availability of Faraday’s fundamental IP on UMC’s 22nm ultra-low-power (ULP) and ultra-low-leakage (ULL) processes. The silicon-proven 22ULP/ULL fundamental IP, including multi-Vt standard cell libraries, ECO libraries, IO libraries, PowerSlash kit, and memory compilers, offers significant power reduction for the next level of SoC design...

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Demand for Preemptive 3Q19 DRAM Shipment Rises, Pushing Global DRAM Revenue Up by 4%

According to the DRAMeXchange research division of TrendForce, demand-side inventory in 2H19 has returned to relatively healthy levels. Furthermore, some vendors pulled their quarterly product shipment forward in an effort to avoid potential negative impacts from Trump’s impending tariffs; this shift skyrocketed DRAM suppliers’ sales bits in 3Q19...

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TSIA Q3 2019 Statistics on Taiwan IC Industry

The TSIA survey showed that Q3 2019 Taiwan IC revenue as a whole (including design, manufacturing, packaging and testing) totaled NT$721.7 billion(US$23.9B) (15.4% growth on-quarter and up 4.4% on-year). With NT$186.0B in design(US$6...

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Aetina Provides Rich Develop Choice of Embedded Equipment Based on GPU

TAIPEI, Taiwan - Since AI rules the generation now, the amount of smart applications had requested higher and higher, which also provide the AI embedded system and application developers a various choice to start their project...

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KIOXIA Introduces Industry’s First 512GB Automotive UFS

KIOXIA Corporation today announced that it has begun sampling the industry’s first 512 gigabyte (GB) Automotive Universal Flash Storage (UFS) JEDEC Version 2.1 embedded memory solution. KIOXIA’s Automotive UFS supports a wide temperature range (-40°C to +105°C), meets AEC-Q100 Grade2 requirements and offers the extended reliability required by various automotive applications...

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