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Tej Kohli Foundation Advocates a Scalable, Accessible and Affordable Solution to End Corneal Blindne
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Published: Oct 14,2019
2019 Microprocessor Slump Snaps Nine Years of Record Sales
MPU market being pulled down by weakness in smartphones and servers, as well as the fallout from the U.S. China trade war. A modest rebound is expected in 2020, followed by new all-time high sales in 2021. The microprocessor market’s string of nine straight record-high annual sales between 2010 and 2018 is expected to end this year with worldwide MPU revenue dropping 4% to about $77...
TV Panel Makers Began to Massively Reduce Capacities in Sep., Says TrendForce
According to WitsView, a division of TrendForce, its latest survey showed that TV panel prices generally have been lower than the cash costs. Thus, panel makers' loss of money has continually expanded. Korean, Taiwanese and Chinese panel makers all started to lower their utilization rates (UT) of TV panel products from September on, in order to improve the severely unbalanced supply and demand and stabilize the prices...
FarEasTone to Launch Taiwan’s First 5G IoT Open Trial Field
TAIPEI, Taiwan - In order to increase the speed of 5G industry promotion and the development of innovative applications for the Internet of Things (IoT), FarEasTone together with the Department of Information Technology, Taipei City Government...
SolarEdge Files Three Patent Infringement Lawsuits Against Huawei in China
SolarEdge Technologies announced today that it has filed three lawsuits for patent infringement against Huawei Technologies Co., Ltd., a Chinese entity. SolarEdge is evaluating filing additional actions to protect its patents...
Mitsubishi Electric’s New Plant in Gujarat, India to Produce Automotive Products
Mitsubishi Electric announced today that it will start construction of a new plant on the premises of its subsidiary Mitsubishi Electric Automotive India Pvt. Ltd (MEAI) in Gujarat, India. The company’s new plant, along with one in Manesar...
Samsung Develops 12-Layer 3D-TSV Chip Packaging Technology with Over 60,000 TSV Holes
Samsung Electronics today announced that it has developed the industry's first 12-layer 3D-TSV (Through Silicon Via) technology. Samsung's new innovation is considered one of the most challenging packaging technologies for mass production of high-performance chips...
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