Micron Announces New NOR Flash memory, Winbond Licensed First
Micron Technology today announced XTRMFlash memory, a faster NOR flash solution designed to revolutionize the way the electronics industry develops systems to meet the demand for "instant-on" performance and fast system responsiveness in automotive, industrial and consumer applications...
UL Establishes PCB Performance Testing services Lab in Taiwan
TAIPEI, Taiwan － UL today offically opened its printed circuit board performance testing services laboratory in Taipei. With the UL746 and UL796 safety certification, UL is going to provide a more complete product specification testing and inspection services for the local printed circuit board firms...
China and AMD Form Chips Assembly & Testing Joint Venture
TAIPEI, Taiwan － Chinese Nantong Fujitsu Microelectronics Co., Ltd. announced the acquisition of two Advanced Micro Devices（AMD）foundries located in Suzhou and Penang, Malaysia, paying for $370 million. They will finish the transaction in the first half of 2016 and create a joint venture of semiconductor assembly and test...
Major Foundries Ready to Battle for a Share of China’s Fast-Growing IC Market
According to global market research firm TrendForce, Chinese IC design houses have benefitted from generous government subsidies in recent years. Moreover, Chinese OEM vendors are extending their overall share of the downstream system market worldwide...
Mentor Graphics Veloce VirtuaLAB Adds Next-Generation Protocols
CALIFORNIA, USA — Mentor Graphics Corp., on Octorber 19 announced the Veloce VirtuaLAB Ethernet environment with support for 25G, 50G and 100G Ethernet. This support enables highly efficient, emulation-based verification for the massive Ethernet-based designs being created today...
200mm Wafer Fab Capacity Forecast to 5.4 Million wspm in 2018
According to a lastest report, from SEMI, worldwide 200mm semiconductor wafer fab capacity is forecast at 5.2 million wafer starts per month (wspm) in 2015 and expanding to 5.4 million wspm in 2018. Based on the rapidly increasing number of internet-enabled mobile devices and the emergence of the IoT (Internet of Things), demand for sensors, MEMS, analog, power and related semiconductor devices is growing...
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