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Smart Government Pavilion to Kick off "Smartly" at Taiwan IT Month Expo 2017

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Published: Dec 06,2017

Hon Hai Teams Up with Intel to Establish 5G Smart Applications in Taiwan

TAIPEI, Taiwan - The Hon Hai Group is teaming up with Asia Pacific Telecom Co., Ltd. and Intel to jointly create 5G smart applications in the following four domains: Augmented Reality (AR) and Virtual Reality(VR) lenses, medical treatment, Internet of Vehicles (IoV), and smart retail...

STM Collaborates with Amazon Web Services on STM32-Based IoT Node-to-Cloud solution

STMicroelectronics announced today its collaboration with Amazon Web Services (AWS) on Amazon FreeRTOS, the latest addition to the AWS Internet of Things (IoT) solution, offering a complete IoT node-to-cloud solution to the market...

Innolux’s 100” High Brightness PID Wins Taiwan Excellence Silver Award 2017

TAIPEI, Taiwan - Innolux’s 100-inch high brightness PID module was honored the 26th Taiwan Excellence Silver Award 2017 which is regarded as the most credible national award. Five other products, 50-inch Mega-Zone display module, 21...

Gen 10 and Larger Flat Panel Display Capacity to Grow at 59% CAGR to 2022, IHS Markit Says

With BOE, China Star, LG Display and Foxconn expected to build seven new Generation 10.5 factories by 2020, Gen 10 and larger fab flat panel display (FPD) capacity is expected to grow at a compound annual growth rate of 59 percent between 2017 and 2022, according to IHS Markit...

Mitsubishi and the University of Tokyo Reducing SiC Power Semiconductor Resistance by Two-Thirds

Mitsubishi Electric Corporation and the University of Tokyo announced today that they believe they are the first to quantify the impacts of three electron-scattering mechanisms for determining the resistance of silicon carbide (SiC) power semiconductor devices in power semiconductor modules...

Samsung Starts Producing First 512GB Universal Flash Storage

Samsung Electronics today announced that it has begun mass production of the industry’s first 512-gigabyte (GB) embedded Universal Flash Storage (eUFS) solution for use in next-generation mobile devices. Utilizing Samsung’s latest 64-layer 512-gigabit (Gb) V-NAND chips, the new 512GB eUFS package provides unparalleled storage capacity and outstanding performance for upcoming flagship smartphones and tablets...

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