DENSO and NEC Establish a JV to Develop Essential Connectivity Technologies for Cars
DENSO and NEC Platforms, Ltd., a subsidiary of NEC Corporation, today unveiled a new joint venture, DENSO NEXT CO., LTD. The company will develop in-vehicle information and communications equipment critical for fostering a truly connected environment inside vehicles...
Samsung Starts Mass Production of Its 2nd Generation 10nm FinFET Process Technology
Samsung Electronics today announced that its Foundry Business has commenced mass production of System-on-Chip (SoC) products built on its second generation 10-nanometer (nm) FinFET process technology, 10LPP (Low Power Plus). 10LPP process technology allows up to 10-percent higher performance or 15-percent lower power consumption compared to its first generation 10nm process technology, 10LPE (Low Power Early)...
Four Macronix Technical Papers Selected for 2017 IEDM
HSINCHU, Taiwan - Macronix International today announces that it has four technical papers selected for presentation at 2017 IEEE International Electron Devices Meeting (IEDM) which is taking place in San Francisco, USA from December 2-6...
Canadian Solar to Establish Factory in Taiwan
TAIPEI, Taiwan - Global top five solar modular manufacturer Canadian Solar will establish a factory in Taiwan, which will possibly be located in Houkou Township, Hsinchu with a production capacity of approximately 500 million watts(MW) module capacity...
DOCOMO Develops Multi-Profile SIM for Smartphones and Tablets
NTT DOCOMO announced today that in collaboration with Gemalto, it has developed the world's first multi-profile SIM for use through multi-carrier collaborations that can allow users to switch between profiles, which include data such as contract information and telephone numbers, on their smartphone or tablet in each country...
ASE to Enlarge High-End Packaging Plant in Kaohsiung
TAIPEI, Taiwan - The ASE Group is the largest semiconductor packaging manufacturer globally and will expand their high-end packaging production capacity in their planned Kaohsiung high-end packaging plant. Furthermore, they have already formally submitted their requirements for land to the Ministry of Economic Affairs and Kaohsiung City Government...
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