IC Insights announced today that they had updated its 2018 McClean Report (MR18). The biggest adjustments to the original MR18 IC market forecasts were to the memory market; specifically the DRAM and NAND flash segments. The DRAM and NAND flash memory market growth forecasts for 2018 have been adjusted upward to 37% for DRAM (13% shown in MR18) and 17% for NAND flash (10% shown in MR18)...

DELO Industrial Adhesives has extended its device portfolio by another two curing lamps. A new generation of area lamps with a wavelength of 365 nm is now available. Compared to their previous models, the enhanced DELOLUX 20 / 365 and DELOLUX 202 / 365 LED lamps deliver much higher intensity...

(圖一) Figure 1 The latest update to the SEMI World Fab Forecast report, published on February 28, 2018, reveals fab equipment spending will increase at 5 percent in 2019 for a remarkable fourth consecutive year of growth as shown in figure 1...

Since the global economic recession of 2008-2009, the IC industry has been on a mission to pare down older capacity (i.e., ≤200mm wafers) in order to produce devices more cost-effectively on larger wafers. The spree of merger and acquisition activity and the migration to producing IC devices using sub-20nm process technology has also led suppliers to eliminate inefficient wafer fabs...

Samsung Electronics announced that it broke ground on a new EUV (extreme ultraviolet) line in Hwaseong, Korea, aiming to maintain its leadership in state-of-the-art semiconductor technology. With this new EUV line, Samsung will be able to strengthen its leadership in the single nanometer process technology by responding to market demand from various applications...

The success and proliferation of integrated circuits has largely hinged on the ability of IC manufacturers to continue offering more performance and functionality for the money. Driving down the cost of ICs (on a per-function or per-performance basis) is inescapably tied to a growing arsenal of technologies and wafer-fab manufacturing disciplines as mainstream CMOS processes reach their theoretical, practical, and economic limits...

Imec has designed and fabricated a 16,384-electrode, 1,024-channel micro-electrode array (MEA) for high-throughput multi-modal cell interfacing. The chip offers intracellular and extracellular recording, voltage- and current-controlled stimulation, impedance monitoring and spectroscopy functionalities thereby packing the most cell-interfacing modalities on a single chip, and being the only one to enable multi-well assays...