ASML’s dominance in the semiconductor equipment market continued in 2017, according to the report “Sub-100nm Lithography: Market Analysis and Strategic Issues,” recently published by The Information Network, a New Tripoli, PA-based market research company...

The recently released 2018 edition of IC Insights’ McClean Report shows that the fastest growing types of microprocessors in the last five years have been mobile system-on-chip (SoC) designs for tablets and data-handling cellphones and MPUs used in embedded-processing applications...

KAOHSIUNG, Taiwan - Advanced Semiconductor Engineering, Inc. and Cadence Design Systems today announced they have collaborated to release a System-in-Package (SiP) EDA solution that addresses the challenges of designing and verifying Fan-Out Chip-on-Substrate (FOCoS) multi-die packages...

TAIPEI, Taiwan - TSMC on last Friday in Southern Taiwan Science Park held a groundbreaking ceremony for the first phase of construction on their Fab 18 factory with CEO Morris Chang personally presiding over the ceremony. Construction and installation are expected to be completed in the first quarter of 2019 with mass production commencing early in 2020...

Samsung Electronics has announced today its continued commitment to first-pass silicon success for its foundry customers’ chip designs by launching the Samsung Advanced Foundry Ecosystem (SAFE) program. The SAFE program ensures deep collaboration between the Samsung Foundry...

HSINCHU, Taiwan - Global Unichip Corporation (GUC) today celebrates its 20th anniversary with a party at its Hsinchu, Taiwan headquarters themed around "Celebrate Two Decades of Innovation and Lofty Dreams". The company was established on January 22, 1998...

Samsung Electronics today announced that it has started mass production of the industry’s first 16-gigabit (Gb) Graphics Double Data Rate 6 (GDDR6) memory for use in advanced graphics processing for gaming devices and graphics cards as well as automotive...