32-Bit RX23T MCU Feature On-Chip Floating Point Unit
Renesas Electronics Corporation introduced the RX23T Group of microcontrollers (MCUs), designed to enable highly precise control of inverter circuits employed in energy-efficient electric home appliances, industrial machinery, and office equipment...
New Tensilica Fusion DSP Sets Low-Energy Benchmarks for IoT and Wearables
Cadence Design Systems announced the new Cadence Tensilica Fusion digital signal processor (DSP) based on the proven Xtensa Customizable Processor. This scalable DSP is ideal for applications requiring merged controller plus DSP computation, ultra-low energy and a small footprint...
Flexible Design for Capacitive Touch-Based Human-Machine Interface Applications
Renesas Electronics Corporation announced its new touch sensing starter kit for the RX113 Group of 32-bit microcontrollers (MCUs), which incorporate capacitive touch sensor intellectual property (IP) that enables high sensitivity, high noise immunity, and excellent water resistance...
Multi-core MCU Enable Functional Safety and Encryption in Automotive Systems
STMicroelectronics announced new members in its multi-core microcontroller (MCU) family aimed at making cars safer. These new devices are the first to be launched with ST's proprietary in-house 40nm embedded Flash process. The new automotive MCUs combine compliance with the most stringent automotive safety standards...
Axiomtek Robust Industrial Firewall Appliance- IFW320
Axiomtek has launched IFW320, an industrial 2-port Gigabit firewall with network address translation (NAT) and VPN all-in-one appliance. Equipped with stateful packet inspection, Denial of Service (DoS), and Intrusion Detection & Prevention (IDP), the din-rail industrial firewall appliance could be used to protect machine and equipment connecting to un-trusted internet...
Synopsys' Modeling of 10nm Parasitic Variation Effects Ratified by Open-Source Standards Board
Synopsys, Inc. today announced new extensions to its open-source Interconnect Technology Format (ITF) which enable modeling of complex device and interconnect parasitic effects at the advanced 10-nanometer (nm) process node. The new extensions include modeling of variation effects due to multi-patterning technology (MPT)...
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