Benefit from 20nm technology, Xilinx UltraScale devices enable next generation smarter systems with new high-performance architectural requirements for applications such as 400G OTN, packet processing and traffic management, 4X4 Mixed Mode LTE, WCDMA Radio, 4K2K and 8K displays, Intelligence Surveillance and Reconnaissance (ISR), and high-performance computing applications for the data center.

"The delivery of UltraScale devices on TSMC's 20nm process technology marks a new juncture for the semiconductor industry," said TSMC vice president of R&D, Dr. Y.J. Mii.

"We are happy to see Xilinx continue to break new ground and deliver 20nm silicon to its customers."

Except 20-nanometer products, Xilinx also work with TSMC in 16nm process, is expected to be launched in 2014.