Built using TSMC's 16FF+ process, the Zynq UltraScale+ MPSoC enables the development of next-generation embedded vision, ADAS, I-IoT and communications systems by providing 5X system-level performance/watt and any-to-any connectivity with the security and safety required for next-generation systems.

"TSMC's ongoing collaboration with Xilinx has resulted in the early shipment of a world class 16nm FinFET multiprocessing SoC," said Dr. BJ Woo, TSMC vice president of Business Development.

"Xilinx and TSMC have clearly demonstrated and delivered industry-leading silicon performance with the lowest power consumption, and highest level of systems integration and intelligence among all programmable logic products to date."

"The early delivery of our Zynq UltraScale+ MPSoC 16nm device extends our outstanding track record for total execution and absolute quality. We call this a "Three-Peat" – being first to market with leadership products at 28nm, 20nm, and now at 16nm," said Victor Peng, executive vice president and general manager of the Programmable Products Group at Xilinx.