TSMC today held its Q3 investor conference to announce its revenue of the third quarter this year , and also stressed the development progress of the advance technologies.

TSMC Co-CEO Mark Liu said that while the growth of smartphones has slowed down, but the silicon contents of smartphones continued to increase, especially in high-end smartphones. Therefore, the high-end smartphones will continue to be the main growth momentum of TSMC in the next two to three years, and led the wafer node technology to advance to higher process.

In addition to high-end smartphones, TSMC is also optimistic about the other three market trends, including the computing, fabless System company and IoTs.

Liu pointed, emerging fabless System company will bring more business opportunities from TSMC in terms of SoC design and hardware and software integration.

As for the advanced process technology, Liu said that TSMC's 10 nm and 7-nm process technology goes well. The technology qualification of 10nm is expected to begin in the fourth quarter of this year, and customer’s product tapout will be next spring. He also pointed that a full-fuction 7nm SRAM was already demostrated.

Liu stressed, compared with the 16nm technology, 10 nm process increase 2.1 times of density, the performance up to 20% and power consumption can be reduced by 40%. The performance of 7nm process can be further improved.