The earthquake’s epicenter located in Kaohsiung, Taiwan, its strong shock wave caused intense shaking in the Tainan Science Park where TSMC’s Fab 14 and Fab 6 are located and had been affected.

TSMC said that the earthquake did not cause any serious personnel injuries nor any structural or facility damage to the Company’s Fab 14 and Fab 6 manufacturing sites in the Tainan Science Park. The earthquake also did not cause equipment to shift position. Damage to wafers in progress remains under assessment, but TSMC’s initial estimate is that more than 95 percent of the tools can be fully restored to normal in two to three days.

TSMC stressed that the company is deploying personnel from Hsinchu and Taichung sites to support recovery in Tainan, and does not expect the earthquake to affect first quarter 2016 wafer shipment by more than 1 percent. TSMC will soon notify affected customers and will recover any lost production as soon as possible.

In addition to TSMC, Taiwan’s another IC foundry, UMC, also had damaged. UMC said that its four fab plants in the Tainan Science Park had some damages which caused by the earthquake, including wafer breakage, wafer transporting system crash. But the production line still can operate.