TSMC explained that currently their 10-nm production is progressing well. They have already obtained design orders from three clients, and this will gradually expand at the end of the year.

In addition to kicking off 10-nm mass production, in 2018 TSMC will officially commence their even more advanced 7-nm production.

Co-Chief Executive Officer Mark Liu pointed out that 7-nm is expected to undergo successful trial production in 2017 and formally go into mass production in 2018. In addition over 95% of the same equipment can be used for both 7-nm and f10-nm production. Because 7-nm will not require much of an increase in spending, the density of the wafers can be greatly improved while also reducing power consumption and enhancing the effectiveness of the wafers.

In addition, TSMC is already actively planning production of the more advanced 5-nm.

(TR/ Phil Sweeney)