The S900 is MediaTek’s first flagship smart TV SoC, supporting 8K resolution and high-speed edge AI computation. Designed to help TV manufacturers create highly competitive flagship products, the integrated S900 supports features including AI voice-user interface and picture quality enhancements, enabling the next generation of smart TVs to deliver a vastly improved user experience.

TSMC’s ultra-low power 12FFC process leads the foundry segment’s 16/14nm generation technologies in reducing die size and power consumption, which is essential for digital TV applications. It provides a sweet spot between performance and low power that is ideal for enabling voice recognition and edge AI capabilities in consumer electronics, wearables and Internet of Things (IoT) devices.

“TSMC has been a key strategic partner of MediaTek for a long time, and their advanced processes have consistently enabled MediaTek’s industry-leading designs with innovative features which have satisfied the stringent requirements of our SoC solutions,” said H.W. Kao, Corporate Vice President of MediaTek. “We see a strong global demand for 8K televisions, and we are delighted to join hands with TSMC to collaborate on advanced technology for 8K TV SoCs to drive the growth of the premium smart TV segment.”

“MediaTek has long been recognized as a leader in consumer electronics. TSMC is pleased to have the opportunity to continue our long history of collaboration and working together on such an innovative product as the S900,” said Dr. Kevin Zhang, TSMC’s Vice President of Business Development. “We will continue to expand our ultra-low power technology offering to help our customers to create AI-enabled SoCs to enrich smart homes for a smarter world.”