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M31 and Macroblock Work Together to Deploy the Global LED Driver IC Market
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Published: Mar 07,2018
High-power LED Package Products in Chinese Market Saw Slight Price Drop, Says TrendForce
The prices of most LED package products in the Chinese market remained stable in February 2018, and some of the products saw slight price drop as suppliers tried to clear inventory, says LEDinside, a division of TrendForce. According to LEDinside analyst Terri Wang, a few of high-power ceramic-substrate LED package products have a slight price drop of 0...
Intel, Lenovo and Diaceutics Collaborate on Development of AI Technology in Patient Care
At the Healthcare Information and Management Systems Society (HIMSS) Conference 2018, Intel unveiled a collaboration with Lenovo and Diaceutics that will allow doctors and health care providers to harness the power of artificial intelligence (AI) to transform patient diagnostic testing and improve treatment...
Agricultural Technology Transfer to Benefit Both of Malaysia and Taiwan
TAIPEI, Taiwan - Taiwan’s Agriculture Minister Lin Tsung-hsien on March 3 visited Taiwanese businesspeople-operated companies and retailers in Kuala Lumpur that have been selling Taiwan-produced agricultural products, hoping to expand the market share of halal market and to promote Taiwan-produced fertilizer, seeds, agricultural machines in Malaysia...
ASE and TDK Establish Joint Venture to Provide Wearable Chip Package Solutions
TAIPEI, Taiwan - ASE yesterday announced together with TDK the joint establishment of ASE Embedded Electronics Incorporated, and in the future they will utilize TDK-authorized SESUB technology in the production of IC embedded substrates and provide mobile and wearable device products for the semiconductor industry...
TDK to Acquire Chirp Microsystems, Aiming for Leadership in Ultrasonic Sensing Solutions
TDK Corporation announced that it has reached an agreement with Chirp Microsystems, Inc., a pioneer in high-performance ultrasonic sensing, in which Chirp becomes a wholly owned subsidiary of TDK. TDK expects to close the acquisition within the coming days...
92 IC Wafer Fabs Closed or Repurposed From 2009-2017
Since the global economic recession of 2008-2009, the IC industry has been on a mission to pare down older capacity (i.e., ≤200mm wafers) in order to produce devices more cost-effectively on larger wafers. The spree of merger and acquisition activity and the migration to producing IC devices using sub-20nm process technology has also led suppliers to eliminate inefficient wafer fabs...
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