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Flexible AMOLED Panel Supply Capacity to Exceed Demand by 44% in 2018, IHS Markit Says
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Published: Nov 14,2017


Intel and Micron Increase 3D XPoint Manufacturing Capacity with IM Flash Fab Expansion
Intel and Micron announced the completion of an expansion to Building 60 (B60) at the IM Flash facilities in Lehi, Utah. The expanded fab will produce 3D XPoint memory media, a building block of Intel Optane technology that includes Intel Optane memory for clients, the recently announced Intel Optane SSD 900P Series and new capacities and form factors of the Intel Optane SSD DC P4800X Series...

Huawei and Gemalto Team Up to Accelerate NarrowBand IoT Deployments
Gemalto and Huawei - via its semiconductor arm, HiSilicon - are working together to develop the next generation of modules that combine an extra level of security and consume very low power. NB IoT has been developed to address lower bit rates and lower cost segments, and works virtually anywhere...

TrendForce Reports 3Q17 DRAM Revenue Hit a New High With a 16.2% Sequential Increase
Revenue of the entire global DRAM industry climbed to a new historic high for the third quarter of 2017, reports DRAMeXchange, a division of TrendForce. Contract prices of various DRAM products jumped by about 5% on average in the third quarter from the second quarter on the back of the year-end busy season and limited bit supply growth...

Face Detection Accounts for Major Share of Apple's Patents with Most Recognition Technologies
Apple's facial recognition patents, consisting of face detection (including image pre-processing) and recognition (including feature extraction), account for 45% of its granted patents, according to Taipei-based IT research institute MIC (Market Intelligence & Consulting Institute)...

Intel Doubles Capacity of Its Optane Data Center SSD
Intel announced the Intel Optane SSD DC P4800X Series is now available in a new 750GB capacity in both half-height, half-length add-in card and a hot-swappable 2.5-inch U.2 form factor. Both form factors and capacities will be broadly available this month...

China Telecom and TransTeleCom Launch the First 100G Link Between Asia and Europe
China Telecom and TransTeleCom have developed the first transit telecommunication route connecting China and Europe based on100G ULH (Ultra Long Haul) DWDM technology. As part of the project, the companies have constructed a new 100Gbps gateway interface on the border between the two countries, the Chinese city of Manzhouli and in the Russian city of Zabaikalsk...