CPT and imec to Demonstrate 1250 ppi, FMM-free OLED Displays with Photolithography at Touch Taiwan
TAIPEI, Taiwan – Chunghwa Picture Tubes Ltd. (CPT) together with the European research institute imec in the framework of the Holst Centre collaboration, showcase today an ultra-high resolution display realized by photolithography patterning of organic light emitting diode (OLED) arrays...
DRAM Supply to Remain Tight With Its Annual Bit Growth for 2018 Forecast at Just 19.6%
DRAMeXchange, a division of TrendForce, forecasts that the global DRAM supply for 2018 will show an annual bit growth of just 19.6%, which is another low in recent years. The global top three major DRAM suppliers – Samsung, SK Hynix and Micron – are now in the midst of their capacity planning for 2018...
GIS to Showcase Its Full-size Smart Touch Display Application at the Touch Taiwan
GIS announced today that the company will showcase its full-size smart touch display application at the Touch Taiwan, 2017 from September 20 to 22, including high screen to body ratio of curved, thin, narrower border and flexible smart phone, automotive and 3D curved lamination, large-size electronic whiteboard products, metal touch, and a number of advanced special application technology...
Intel Invests $1 Billion in the AI Ecosystem
Intel announced that it has invested in startups like Mighty AI, Data Robot and Lumiata through its Intel Capital portfolio and have invested more than $1 billion in companies that are helping to advance artificial intelligence...
AUO Presents World’s Largest 8K4K Bezel-less TV Display
HSINCHU, Taiwan – AU Optronics Corp. (AUO) announced today that it will participate in Touch Taiwan 2017 at Taipei Nangang Exhibition Center from September 20 to 22 to showcase a full lineup of advanced large-sized display technologies and products...
Intel Showcases Industry’s First 64-Layer 3D NAND for Data Center, Updates for 10nm in China
Intel delivered key updates at its Technology and Manufacturing Day held in Beijing, China, on Sept. 19. Disclosures included power and performance updates for Intel’s 10 nm process, high-level plans for Intel’s first 10 nm FPGA, and an announcement that the company is shipping the industry’s first commercially available 64-layer 3D NAND for data center applications...
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