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Samsung Adds 11nm FinFET Process Technology to Its Advanced Foundry Process Portfolio
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Published: Sep 11,2017
APM will Attend SENSOR CHINA Expo & Conference 2017 in Shanghai
TAIPEI, Taiwan - Asia Pacific Microsystems, Inc. (APM), announced that the company will attend SENSOR CHINA Expo & Conference 2017 in Shanghai, China, from Sep 11th to 13th. APM said that the company will showcase its MEMS fabrication capabilities and welcome visitors to discuss the possibility of contracting MEMS device development and manufacturing with APM...
Taiwan Introduces Its Robot Standard Label and Five Qualifiers
TAIPEI, Taiwan – The Taiwan Robot Standard (TARS) was introduced by the Taiwan Automation Intelligence and Robotics Association(TAIROA) for the first at the Taiwan Robotics and Intelligent Automation Show (TAIROS) yesterday, including HIWIN Technologies, Delta Electronics, Techman Robot, EVERMORE MACHINE and Reed Automation were the first companies that passed the certification of TARS...
Prices of LED Light Bulbs Slightly Declined This August, TrendForce Reports
Prices of LED light bulbs showed a slight decline this August, according to the latest reporting from LEDinside, a division of TrendForce. Compared with July, the global ASP of 40-watt equivalent LED light bulbs fell by 1.1% to US$6...
SoftBank, Sprint, Far EasTone and TBCASoft Launch Blockchain Consortium for Telecom Carriers
Japan-based SoftBank, U.S.-based Sprint Corporation, Taiwan-based Far EasTone Telecommunications and U.S.-based TBCASoft today announced the launch of a new blockchain consortium, the Carrier Blockchain Study Group (“CBSG”)...
AI to Propel Revenue from Semiconductor Chip Sales Worldwide at a CAGR of 3.1% in 2018~2022
According to market intelligence firm TrendForce, AI will create new market opportunities as well as upgrading the fabrication process for semiconductor manufacturers. With AI becoming a major growth contributor, TrendForce forecasts that the global revenue from semiconductor chip sales will grow at a CAGR of 3...
congatec Announces Its New Roadmap for Bringing 10 GbE Interconnectivity to the Industrial Fields
congatec announces its new extended roadmap for bringing 10 GbE interconnectivity to the industrial fields. Developed to enable embedded system engineers to design small form factor edge nodes with a low power envelope of less than 20 watts, congatec is breaking new ground to realize the industry vision of entirely enclosed, fanless infrastructure components...
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